Int. J. of Applied Mathematics, Computational Science and Systems Engineering

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Received: February 7, 2021. Revised: August 4, 2021. Accepted: September 2, 2021. Published: September 18, 2021.

Comparison of transient thermography methods for defect detecting in electronic components and modules

Author(s): Anna Andonova

Abstract: The article examines different methods of transient thermography applied to analyze the faults and detection of hidden defects in electronic components and modules. A brief analysis of the methods and recommendations for their application is presented. A systematic approach to designing a transient thermographic measurement system for the detection and analysis of faults and hidden defects in electronic components and modules is developed. Some experimental results are shown.

Keywords: fault diagnostic;, transient thermography; electronic components and modules; quality;

Pages: 94-98

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